Die Brush & Foam Pad For Wafer Thin Dies
- Part of the Alterations collection.
- Designed by Tim Holtz
UPC: 841182097989
EAN: 841182097989
Added: Jan. 2015
Categories • Die Brush • Machine Accessories
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
"Alterations" collection also includes:
